Schmadlak, Ilko: search on Z-Library

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1

Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack Propagation

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh K.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.61 MB

english, 2014

2

[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Strength characterization of TEOS and FTEOS interlayer dielectric materials to compare fracture risk in die stack by 3D FE simulation approach

Lakhera, Nishant, Howell, Jim, Kipperman, Scott, Welsh, Evan, Schmadlak, Ilko

Year:

2017

Language:

english

File:

PDF, 25.13 MB

english, 2017

3

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Simulation of Wafer Probing Process Considering Probe Needle Dynamics

Schmadlak, Ilko, Hauck, Torsten

Year:

2007

Language:

english

File:

PDF, 4.46 MB

english, 2007

4

Nonlinear buckling analysis of vertical wafer probe technology

Torsten Hauck, Wolfgang H. Müller, Ilko Schmadlak

Journal:

Microsystem Technologies

Year:

2010

Language:

english

File:

PDF, 858 KB

english, 2010

5

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Hauck, Torsten, Schmadlak, Ilko, Lakhera, Nishant, Shantaram, Sandeep, Samet, David, Rambhatla, V. N. N. Trilochan, Sitaraman, Suresh

Year:

2017

Language:

english

File:

PDF, 3.56 MB

english, 2017

6

[ASME ASME 2014 International Mechanical Engineering Congress and Exposition - Montreal, Quebec, Canada (Friday 14 November 2014)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh K.

Year:

2014

Language:

english

File:

PDF, 1.94 MB

english, 2014

7

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Framework to extract cohesive zone parameters using double cantilever beam and four-point bend fracture tests

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh K.

Year:

2014

Language:

english

File:

PDF, 1.03 MB

english, 2014

8

Mixed-Mode Cohesive Zone Parameters for Sub-Micron Scale Stacked Layers to Predict Microelectronic Device Reliability

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh K.

Journal:

Engineering Fracture Mechanics

Year:

2015

Language:

english

File:

PDF, 2.60 MB

english, 2015

9

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Power QFN down bond lift and delamination study

Zhang, Hanmin, Hu, M., Wang, Sonder, Ilko, Schmadlak, Yin, B. G, He, Q. C, Ye, D. H

Year:

2014

Language:

english

File:

PDF, 625 KB

english, 2014

10

[ASME ASME 2013 International Mechanical Engineering Congress and Exposition - San Diego, California, USA (Friday 15 November 2013)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, Suresh

Year:

2013

Language:

english

File:

PDF, 1.01 MB

english, 2013

11

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Stress analysis of a micro-machined inertial sensor at dynamic load

Hauck, Torsten, Schmadlak, Ilko, Mehner, Jan

Year:

2008

Language:

english

File:

PDF, 819 KB

english, 2008

12

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Flip chip laser mark bare die strength characterization

Muniandy, Kesvakumar, Schmadlak, Ilko, Yeung, Betty, Lauderdale, Matt, Uehling, Trent

Year:

2016

File:

PDF, 315 KB

2016

13

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Fracture risk assessment of laser marked die by means of simulation and test

Schmadlak, Ilko, Yeung, Betty, Morgan, Derek, Galles, Paul

Year:

2015

Language:

english

File:

PDF, 1.49 MB

english, 2015

14

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Electro-thermal simulation of a semiconductor power switch considering damage effects

Schmadlak, Ilko, Hauck, Torsten

Year:

2012

Language:

english

File:

PDF, 1.16 MB

english, 2012

15

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Fracture risk assessment for interface flaws in the 3D-interconnect systems of a CMOS chip

Hauck, Torsten, Mueller, Wolfgang H., Schmadlak, Ilko

Year:

2008

Language:

english

File:

PDF, 2.41 MB

english, 2008

16

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Interlayer dielectric cracking in back end of line (BEOL) stack

Raghavan, Sathyanarayanan, Schmadlak, Ilko, Sitaraman, Suresh K.

Year:

2012

Language:

english

File:

PDF, 2.20 MB

english, 2012

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